Umshini wokushisa ongaguquki we-laser wesiteshi esiphindwe kabili

Isikhundla:

Umshini wokushisa ongaguquki we-laser wesiteshi esiphindwe kabili

Incazelo emfushane:

Umshini wokushisa we-laser we-laser wesiteshi esiphindwe kabili uwuhlobo olusha lwemishini eyakhiwe yi-Herolaser.Izinto zokusebenza ziletha i-welding ezinzile engaxhunywanga nge-laser diode (LD) njengomthombo wokushisa onikezwe impendulo yangaphakathi ye-loop evaliwe enokuqapha kwezinga lokushisa kwesikhathi sangempela.

Thumela i-imeyili kithi

Imininingwane Yomkhiqizo

Amapharamitha wesici

Ividiyo

Landa

Unga-oda kanjani

Isingeniso Somkhiqizo

Isisetshenziswa sinezinhlobo eziningi zokusebenza kanye nesistimu yokuphakela izintambo ezizenzakalelayo noma idivayisi yokusabalalisa yokunamathisela ngokunemba kwe-solder ukuze ithengise kahle ngezikhathi ezahlukene.Ngemikhiqizo ethile enembile engakwazi ukucubungula nge-reflow soldering kanye nomshini we-wave soldering, umshini we-laser soldering uzoba inketho yakho ethembekile yokuthengisa imikhiqizo yakho uma unikezwe izici zesakhiwo esizinzile, ukuphumelela kwezindleko, ukusebenza kahle okuphezulu kwe-soldering kanye nobuchwepheshe bokulawula izinombolo.

Ipharamitha Yezobuchwepheshe
Cha.	Into	Ipharamitha
1	Imodeli	I-ML-WS-XF-ZD2-HW80
2	Amandla e-laser	60W-200W
3	Uhlobo lwe-laser	i-semiconductor
4	Gxila ubude bokugxila	80/125/160mm(ngokuzikhethela）
5	Ibanga lokulawula izinga lokushisa	60°C-400°C
6	Ukunemba Kwesistimu Yezinga Lokushisa	±( 0.3% ukufunda + 2°C) (izinga lokushisa elizungezile 23±5°C)
7	I-GPS	ICoaxial CCD ukuqapha kanye indawo ye-CCD yendawo
8	Usayizi wesisetshenziswa	1100mm1450mm1750mm
9	Ibanga lokushisela	250mm * 250mm(indawo yokusebenza eyodwa）
10	Ukondla unhlangothi	1000mm
11	Inombolo yezimbazo ezinyakazayo	6 izimbazo(X1 Y1 Z1/X2 Y2 Z2)
12	Ukuphindaphinda	±0.02mm
13	Uhlelo lokususa uthuli	Isistimu yokuhlanza insipho ezenzakalelayo
14	Isisindo Esiphelele	350Kg
15	Amandla aphelele	≤2.5KW

Izici ezibalulekile

1. Yamukela i-semiconductor laser, esebenza ngendlela yokucubungula okungeyena othintana naye.

2. Akukho ukusetshenziswa kwethiphu ye-soldering iron, esebenza ngezindleko eziphansi kanye nokugcinwa okulula.

3. Iphuzu le-solder lokuma elibonakalayo nge-Dual vision application kanye nohlelo lokuqapha lwe-CCD.

4. I-Laser icubungula ngaphansi kwezinga lokushisa elingashintshi ngempendulo yangaphakathi ye-loop evaliwe yokuqapha izinga lokushisa kwesikhathi sangempela.

5. Indawo yokushisela ingalungiswa ukuze ihlangabezane nosayizi abahlukahlukene bokunamathisela.

6. Faka isistimu yokuhlanza intuthu ukuze isuse kusenesikhathi izinsalela ezivuthayo ekushisweni.

7. Ongakukhetha ukushintsha phakathi kwesiteshi esisodwa kanye nemodi yesiteshi se-Double.