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FPC/Cover film laser cutting machine

Short Description:

FPC/cover film laser cutting machine is a new type of equipment developed by Herolaser. It adopts a new process of ultraviolet laser processing and has the characteristics of higher cutting speed, finer edge chipping, and small heat affected zone.

 

 


Product Details

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Product Introduction

FPC/cover film laser cutting machine is a new type of equipment developed by Herolaser. It adopts a new process of ultraviolet laser processing and has the characteristics of higher cutting speed, finer edge chipping, and small heat affected zone. Using marble platform and high-precision transmission module, stable and reliable laser selection, with high-precision galvanometer control module and laser cutting control system specially developed by Herolaser Laser, it is a collection of the latest precision machinery, CNC technology and other disciplines. High-tech products with stable structure, good rigidity, light weight, small footprint, good processing quality and high efficiency. It is a highly cost-effective laser cutting that combines efficiency, precision and stability equipment.

Model Features

  1. Using UV laser processing, the thermal impact of the product cutting is small.
  2. Using galvanometer laser lens, it can be processed in any shape, cutting without residue, and the corners are smooth.
  3. Adopt high-precision visual positioning system to achieve precise cutting.
  4. Adopt marble platform and precise optical path design to ensure high shock resistance and high-quality laser transmission.
  5. Adopt high negative pressure vacuum machine to adsorb products to ensure positioning stability.
  6. Configure a smoke purification system to take away smoke and dust in time to avoid contamination of the ring mirror.
  7. Single-station processing platform and double-station processing platform mode are available.

 

Product advantages

  1. High-performance UV laser processing; real cold processing, with a series of advantages of laser cutting.
  2. The machine adopts a solid marble structure with excellent seismic performance to ensure machine performance and overall processing accuracy. : Subvert the industry standard without carbonization on the bottom surface, the incision is neat and clean, and there is no burr.
  3. High-speed cutting of any open size, cover film, PI reinforcing sheet, PP reinforcing sheet and other materials.
  4. The non-contact cold working process is adopted, and the material is not deformed, which is suitable for high-precision material cutting.
  5. The software automatically cuts, with the function of cutting multiple sheets at the same time.
  6. Easy to learn software Control software of Windows system, Chinese interface, easy to operate.
  7. Preview function before processing to avoid cutting scrap sheets.

 

Application Range

It is used for the cutting process of PCB circuit boards, FPC and rigid-flex boards, cover films, glass covers, fingerprint identification modules, camera modules and other products.

 

Technical Parameter
Item Parameters
Model ML-CU-DZ-00-HW10
Processing size 400*400mm(Max. customizable)
Machining table Vacuum adsorption
Laser

Galvo

system

Type Nanosecond UV
Laser wavelength 355nm
Laser power 10W/15W/20W/30W (optional)
Focus spot Less than or equal to 35um
Single scan size 40mm*40mm
Galvo scanning speed 10mm/s-5000mm/s adjustable
Camera

Parameter

Number of cameras 1PCS
Camera pixel 5000000
Camera positioning accuracy ±5um
Software support system Win7(32-bit)
Software

System

Software calibration function Vision automatic correction
Software permissions Administrator/Operator
Supported file formats Dxf/gerber
Overall size(length X width X height) 1684*1412*1872mm
Device Body Total power Less than or equal to 3KW
Total Weight 3000Kg
Equipment

Installation

Condition

Microseismic requirements Foundation amplitude5um
Ground bearing 500Kg/m
Compressed air &0.4 Mpa
Dust removal system Automatic soot purification system

 

Sample Display

图片1

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