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Precision Laser Etching Machine

Short Description:

The device uses high-quality laser beams to focus on conductive metal oxides or silver pastes on organic polymers such as glass, PMMA, PET, PE PI, etc. etching on silver paste, copper paste, conductive coating, ITO coating and nano-silver coating on the organic polymer.

 

 


Product Details

Feature parameters

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How to order

Product Introduction

Features

  1. High-quality laser and beam with high photoelectric conversion rate to ensure the reliability and consistency of etching;
  2. Advanced optical system, low power consumption, small focusing spot, high beam quality, good processing accuracy, and automatic focusing;
  3. Imported motion modules and control modules are used to ensure that the equipment has high positioning accuracy and repeat positioning accuracy;
  4. CCD automatic alignment recognition to achieve precise coincidence of the laser processing path and the datum point of the design drawing, to ensure the accuracy of the processing graphics;
  5. The marble working platform can effectively reduce vibration during the equipment processing and maintain the stability of the machine processing;
  6. Self-developed intelligent laser etching system, friendly application platform, powerful functions, simple operation, and is compatible with a variety of file formats.

 

Product Advantages

  1. The design can be changed flexibly, the product introduction cycle is short, and the reliability is high;
  2. Non-contact dry processing without subsequent cleaning and pollutant discharge;
  3. Ultra-micro structure, greatly improve the utilization rate of circuit boards;
  4. No template, direct molding, high speed and low cost.

 

Applications

Etching the conductive film layer of capacitive or resistive touch screen, ITO film, conductive silver paste, thin film solar substrate, FPD liquid crystal panel, ITO coated glass, mobile phone, touch screen body GF, GFF, OGS vehicle touch screen body, etc.

 

Technical Parameter

NO.

Item

Parameters

1

Laser Type

Fiber Laser/ YAG Laser

2

Laser Wavelength

1064/355/532nm

3

Light Beam Quality

M2 1.3

4

Work Plan

400X600mm;(Customization is acceptable)

5

Positioning Accuracy

≦0.01mm

6

Movement Speed

200-5000mm/s

7

Spot Diameter

20μm

8

Minimum Etch Line Width

20μm

9

Etched Line Width Accuracy

±3μm

10

Power Supply

AC 220V±10% 50/60Hz

11

Power Consumption

3000W

12

Working Environment

Temperature: 0~45℃; Humidity≤85%

 

Application Scenarios

图片3

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